On June 18, 2025, Airsys Cooling Technologies was named North America Company of the Year by Frost & Sullivan for its advancements in data center thermal management. The award marks a significant milestone for the company and the broader industry as high-performance computing and artificial intelligence drive unprecedented heat loads and energy demands in modern facilities.
Delivering Innovation in Thermal Efficiency
Frost & Sullivan’s recognition stems from Airsys’s development of scalable, energy-efficient cooling technologies designed specifically for high-density server environments. Among its most celebrated solutions are LiquidRack™—a spray liquid cooling system—and the Adsorption Chiller, which enables full heat recovery without the need for traditional chillers.
Airsys’s Advanced Liquid Cooling Technologies (ALCT) division has also developed cutting-edge two-phase micro-channel heat sinks, manufactured via 3D printing. These components have demonstrated the capacity to dissipate more than 2 kilowatts of heat in a compact footprint, with future versions expected to support GPUs drawing up to 3 kilowatts each. These innovations aim to stay ahead of the curve as next-generation AI and graphics processors surpass 700 watts per chip.
Why High-Efficiency Cooling Now Matters More Than Ever
As data centers scale in size and density, cooling represents one of the largest ongoing operational costs. Traditional air-based systems can consume 30% to 55% of a facility’s energy, particularly in environments pushing the limits of rack density.
The growing demand for AI workloads, edge computing, and digital transformation across industries is accelerating the need for more efficient thermal management. Systems like those developed by Airsys help reduce the overall power usage effectiveness (PUE) of data centers—an important metric for energy efficiency. In optimized deployments, PUE ratings near 1.02 to 1.03 are achievable, dramatically reducing waste and operating expenses.
Moreover, sustainable cooling technologies play a vital role in meeting environmental, social, and governance (ESG) targets, allowing operators to reduce carbon footprints without compromising performance.
Inside the Technology: What Sets Airsys Apart
Airsys’s LiquidRack™ system cools high-power electronics through direct fluid contact, delivering coolant precisely to heat-generating components using an atomized spray. Unlike immersion cooling, LiquidRack preserves traditional server formats while offering similar or superior heat dissipation capabilities. The spray is controlled in a sealed, vertical rack arrangement that eliminates reliance on large chillers and allows nearly complete heat reuse.
Meanwhile, the company’s Adsorption Chiller leverages waste heat captured from server operations to produce chilled water for air-handling units or other cooling loads. This closed-loop system not only reduces the need for external energy input but also extends the usable lifecycle of energy within the facility.
Together, these technologies provide a modular, scalable, and retrofittable solution for data center operators seeking to future-proof their infrastructure.
Strategic Growth and Industry Relevance
Airsys continues to scale its innovation footprint with a new 3D-printing facility and expanded manufacturing in South Carolina, positioning itself to meet growing domestic and international demand. Its solutions are particularly relevant to hyperscale, colocation, and modular data centers, as well as edge computing deployments where space and power are constrained.
The company’s ability to combine advanced engineering with practical deployment considerations—such as retrofitting legacy sites or integrating with renewable power—makes its portfolio especially attractive as data infrastructure becomes more decentralized and AI-intensive.
What Comes Next
As the industry looks forward, several areas will be critical to understanding Airsys’s broader impact:
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Adoption trends: Tracking where and how LiquidRack and Adsorption Chiller systems are being deployed, especially in next-generation and regional data centers.
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Competitive benchmarking: Comparing Airsys’s thermal solutions with offerings from industry giants and emerging startups, including immersion and dielectric cooling providers.
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Integration potential: Exploring how Airsys’s technologies can enhance other data center systems, from power distribution to smart automation.
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Regulatory and economic considerations: Evaluating total cost of ownership, water conservation benefits, and incentives from green building or energy efficiency standards.
Final Takeaway
Airsys’s award-winning solutions represent a forward-thinking response to one of the most pressing challenges in digital infrastructure: how to cool more while using less. By prioritizing energy reuse, scalability, and adaptability, the company is setting a high bar for what sustainable performance can look like in tomorrow’s data centers.